Semiconductor device and method of manufacturing the same

ABSTRACT

Each of channel regions  2   a  and  3   b  is covered by a gate electrode  6  via a gate insulation film  5  and side wall spacers  9  from its top face to both side faces along an x-direction. In other words, there is no insulation material of an STI element isolation structure  4  on both side faces along the x-direction of each of the channel regions  2   b  and  3   b  (in a non-contact state), thereby preventing stress in a z-direction from being applied by the STI element isolation structure  4  to each of the channel region  2   b  and  2   b.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2005-096093, filed on Mar. 29,2005, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device having anelement isolation structure by the STI (Shallow Trench Isolation) methodand a method of manufacturing the same.

2. Description of the Related Art

Conventionally, as an element isolation structure, an element isolationstructure formed by the STI method (hereinafter, simply referred to asan STI element isolation structure) has been used in which insulationwithin an active region is ensured by embedding an insulation materialin a groove formed within the element isolation region. This STI elementisolation structure is expected to contribute to demands forminiaturization of semiconductor devices in recent years because it canensure element isolation unlike a field oxide film or the likeprotruding from the substrate surface formed by a so-called LOCOSmethod.

(Patent Document 1) Japanese Patent Application Laid-open No. 2000-22141

(Patent Document 2) Japanese Patent Application Laid-open No. 2004-55640

(Non-Patent Document 1) Y. Kumagai et al., “Evaluation of change indrain current due to strain in 0.13-μm-node MOSFETs”, SSDM, pp. 14-15,2003.

SUMMARY OF THE INVENTION

However, the use of the STI element isolation structure suffers from adecrease in on-current due to stress on the active region applied fromthe STI element isolation structure.

Hence, the following technique has been proposed as a technique torelieve the stress applied to the active region.

For the N-type MOS transistor, a method is employed which forms the gateelectrode of a material and on a condition that the gate electrodeapplies expansion strain to the active region at a lower layer, or thelike. On the other hand, for the P-type MOS transistor, a method isemployed which forms the source/drain region using SiGe to increase theabsolute value of current passing through the channel region or thelike.

In this case, however, the N-type MOS transistor and the P-type MOStransistor are formed by different processes, thus necessarily leadingto increase in processes and complication of processes, and in addition,they need to be formed using materials which have not conventionallybeen used, to encounter many difficulties in technique and manufacturingcost for realization.

In addition, when the STI element isolation structure is used, thestress caused by the STI element isolation structure exhibits differentvalue greatly depending on the width (the gate-width direction), thelength (the gate-length direction), and so on of the active region,especially on the width. As a concrete example, the relationship betweenthe active region width (W (nm)) and the variation in the on-current(ΔI_(on) (%) ) in the N-type and P-type MOS transistors using the STIelement isolation structure is shown in FIG. 8. The case of ΔI_(on)being 0% represents the state in which the channel region is notstrained at all, that is, the state in which the stress is completelyreleased. As shown in the drawing, in both the N-type and P-type MOStransistors, as the gate width is decreased, the influence of the stressby the STI element isolation structure increases (when both of them arecompared, the P-type MOS transistor is influenced by the stress moregreatly than the N-type MOS transistor) and the on-current decreases. Asdescribed above, especially the dependence on the active region widthfor the on-current (hereinafter, referred to as the gate-width directiondependence) becomes more serious as the device is miniaturized further.The problem of the gate-width direction dependence cannot be solved evenwhen the above-described methods are applied to the case using the STIelement isolation structure.

As countermeasures against the problem specialized for the STI elementisolation structure, for example, approaches are made, such as anapproach of seeking a new material applying less stress as theinsulation material of the STI element isolation structure, an approachof forming a buffer material film referred to as a liner in a groove ofthe STI element isolation structure to relieve the stress, and so on.This case, however, also requires a material which has notconventionally been used. In addition, the change of the insulationmaterial of the STI element isolation structure or the insertion of theliner is far from sufficiently relieving from the stress.

As described above, when the STI element isolation structure is used, adevice structure with less gate-width direction dependence of the stressis demanded to relive the stress applied to the active region andefficiently reduce the stress, in order to improve the on-current.Presently, a technology is being sought which easily and surely meetsthese two demands without causing an increase in processes andcomplication of processes.

The present invention has been developed in consideration of the aboveproblems and its object is to provide a reliable semiconductor devicehaving excellent current characteristics in a semiconductor deviceincluding the STI element isolation structure in which the gate-widthdirection dependence of the stress is significantly reduced and thestress applied to the active regions is relieved easily and surelywithout causing an increase in processes and complication of processes,and a method of manufacturing the same.

A semiconductor device of the present invention, includes: an elementisolation structure formed by embedding an insulation material in agroove formed within an element isolation region of a semiconductorsubstrate; an active region defined in the semiconductor substrate bythe element isolation structure; a gate electrode pattern-formed abovethe active region via a gate insulation film; and a transistor structurehaving a pair of impurity diffused layers formed within the activeregion on both sides of the gate electrode, wherein the elementisolation structure is in a non-contact state with at least both sidefaces along a gate-length direction of a channel region constituting asubstantial current passing region formed between the impurity diffusedlayers within the active region.

A method of manufacturing a semiconductor device of the presentinvention, includes the steps of: forming a groove within an elementisolation region of a semiconductor substrate; embedding an insulationmaterial in the groove to form an element isolation structure to therebydefine an active region on the semiconductor substrate; partiallyremoving the insulation material of the element isolation structure toexpose a surface layer portion of the active region; pattern-forming agate electrode in such a manner as to cover the surface layer portionfrom a top face to both side faces thereof via a gate insulation film;and introducing impurities into the active region on both sides of thegate electrode to form a pair of impurity diffused layers.

A method of manufacturing a semiconductor device of the presentinvention, includes the steps of: forming a groove within an elementisolation region of a semiconductor substrate; embedding an insulationmaterial in the groove to form an element isolation structure to therebydefine an active region on the semiconductor substrate in a shape havingprotruding portions protruding from a pair of side faces of a rectanglerespectively; pattern-forming a gate electrode in a shape extendingalong tops of the protruding portions via a gate insulation film abovethe active region; and introducing impurities into the active region onboth sides of the gate electrode to form a pair of impurity diffusedlayers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are a table and a formula each showing strains requiredto increase the on-current in a channel region taking N-type and P-typeMOS transistors as models;

FIG. 2 is a schematic perspective view showing a configuration of a MOStransistor having a typical STI element isolation structure;

FIGS. 3A to 3C are schematic views showing main processes in a method ofmanufacturing a CMOS transistor according to a first embodiment selectedonly for the P-type MOS transistor;

FIGS. 4A to 4F are schematic cross-sectional views showing the method ofmanufacturing the CMOS transistor according to the first embodiment inthe order of processes;

FIGS. 5A and 5B are schematic views showing processes added to the firstembodiment in a modification example of the first embodiment;

FIGS. 6A to 6C are schematic views showing main processes in a method ofmanufacturing a CMOS transistor according to a second embodimentselected only for the P-type MOS transistor;

FIGS. 7A to 7E are schematic cross-sectional views showing a method ofmanufacturing the CMOS transistor according to the second embodiment inthe order of processes; and

FIG. 8 is a characteristic diagram showing the relationship between thewidth of an active region and variation in on-current in the N-type andthe P-type MOS transistors using the STI element isolation structure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

-Basic Gist of Present Invention-

FIGS. 1A and 1B show strains required to increase the on-current in achannel region taking N-type and P-type MOS transistors as models. FIG.1A is a table showing signs representing strains (compression orexpansion) in x-, y-, and z-directions, which are required to increasethe on-current within the channel region for <110> which is a usuallyused plane azimuth of a semiconductor substrate (see Non-Patent Document1). Further, FIG. 1B is a calculation formula showing the relationshipbetween the change in current and the strain in these models. ε_(xx),ε_(yy), and ε_(zz) represent here strains in the x-, y-, andz-directions respectively, and ΔI_(onN) and ΔI_(onP) represent variationvalues in the on-current in the N-type MOS transistor and the P-type MOStransistor, respectively.

Here, the N-type transistor and the P-type transistor have oppositesigns of strains to increase the on-current in the x-direction (achannel-length direction) and the y-direction (a substrate-depthdirection), but they have the same sign of strains in the z-direction (achannel-width direction). The present inventors pay attention to thestrain in the z-direction showing the same properties both in the N-typetransistor and the P-type transistor, and positively engineer the stressin the z-direction. This enables relief of the compression stress whichdeteriorates the on-current to improve the performance and to restrainthe gate-width direction dependence of the device at the same time inboth the N-type and P-type MOS transistors.

A MOS transistor having the STI element isolation structure usuallytakes the configuration as shown in FIG. 2. FIG. 2 shows a schematicperspective view of the MOS transistor and schematic cross-sectionalviews along a z-y plane and an x-y plane of the MOS transistor. Here, anumeral 101 denotes an STI element isolation structure formed within anelement isolation region of a silicon substrate 100, a numeral 102denotes an active region defined by the STI element isolation structure101, a numeral 103 denotes a gate electrode pattern-formed above theactive region 102 via a gate insulation film 104, a numeral 105 denotesa side wall spacer formed on either side of the gate electrode, and anumeral 106 denotes a source/drain region being either side portion ofthe side wall spacer 105 within the active region 102. Incidentally, ashallow extension region may be formed which partially overlaps with thesource/drain region 106.

The STI element isolation structure 101 is formed such that aninsulation material is filled in a groove formed within the elementisolation region and its surface is flattened, and then its surfacelayer is slightly removed from the above state under the influence ofetching in the formation of the side wall spacers 105, thereby exposingthe surface layer of the active region 102. However, the insulationmaterial of the STI element isolation structure 101 remains withinportions in contact with both side faces along the x-direction within achannel region 102 a between the source/drain regions 106 of the activeregion 102 (between extension regions if they are formed), because thegate electrode 103 and the side wall spacers 105 extending from abovethe channel region 102 a serve as a so-called mask. The remainingportions are represented by numerals 101 a.

The remaining portions 101 a are formed in a manner to hold the channelregion 102 a therebetween in the z-direction, so as to apply compressionstress in the z-direction to the channel region 102 a. Accordingly, itis only required to relieve the compression stress in the z-directionagainst the channel region 102 a applied by the remaining portions 101a. In the present invention, the STI element isolation structures 101like the remaining portions 101 a are formed such that their insulationmaterials are not in contact with at least both side faces along thex-direction of the channel region 102 a. In particular, as will bedescribed in greater detail in the following embodiments, there areconceivable configurations such as one in which the remaining portions101 a are removed before the formation of the gate electrode 103 and onein which the remaining portions 101 a are separated from the channelregion 102 a constituting an actual current passing region between thesource/drain regions 106. Such a configuration is employed to relievethe compression stress in the z-direction. In addition, in this case,the relieve of the compression stress in the z-direction, that is, thegate-width direction also decreases the gate-width direction dependenceto restore the decreased amount of the on-current as shown in thecharacteristic diagram in FIG. 8, thus allowing devices to beminiaturized further without a loss of the on-current. In other words,according to the present invention, the gate-width direction dependencecan be significantly reduced to prevent a decrease in the on-currentboth in the N-type and P-type MOS transistors irrespective of theconduction type thereof.

It should be noted that, as shown in the calculation formula in FIG. 1B,the coefficient of ε_(zz) in ΔI_(onP) is about four times as large asthat in ΔI_(onN), representing that a strain in the z-direction moregreatly contributes to the variation in the on-current. Accordingly, thepresent invention offers a great effect especially for the P-type MOStransistor, as well as for the N-type MOS transistor.

Incidentally, as disclosed in Patent Documents 1 and 2, there aretechniques to restrain the threshold voltage, retrain the parasitictransistor, or the like by devising the form or the like of the STIelement isolation structure in the MOS transistor having the STI elementisolation structure, but there is no disclosure nor teaching on an STIelement isolation structure having the form in the present invention forthe purpose of relieving the stress within the channel region.

-Embodiments to which the Present Invention applied-

Hereinafter, concrete embodiments in which the present invention isapplied to a CMOS transistor will be described in detail with referenceto the drawings. Note that the configuration of the CMOS transistor willbe described in conjunction with its manufacturing method forconvenience of explanation.

-First Embodiment-

FIGS. 3A to 3C are schematic perspective views showing main processes ina method of manufacturing a CMOS transistor according to the firstembodiment selected only for the P-type MOS transistor, and FIG. 3C thatis a completion view of the P-type MOS transistor additionally showsschematic cross-sectional views along a z-y plane and an x-y plane ofthe transistor. FIGS. 4A to 4F are schematic cross-sectional viewsshowing the method of manufacturing the CMOS transistor according to thefirst embodiment in the order of processes, each view corresponding to aschematic cross section along the x-y plane shown in FIG. 3C.

First, as shown in FIG. 3A and FIG. 4A, on a silicon substrate 1, anactive region 2 of the P-type MOS transistor and an active region 3 ofthe N-type MOS transistor are defined, respectively.

More specifically, element isolation structures are formed respectivelywithin the element isolation region for the P-type MOS transistor andthe element isolation region for the N-type MOS transistor on asemiconductor substrate, that is, the silicon substrate 1, so as todefine the active regions 2 and 3 in a rectangular shape. As the elementisolation structures, the STI method is used to fill grooves 4 a, whichare formed within the element isolation regions by lithography and dryetching, with an insulation material such as a silicon oxide or thelike, and then, for example, the CMP (Chemical Mechanical Polishing)method is used to polish for flattening the surface of the insulationmaterial to form STI element isolation structures 4.

Subsequently, as shown in FIG. 3B and FIG. 4B, surface layers 2 a and 3a of the active regions 2 and 3 are exposed, respectively.

More specifically, an etching solution selectively removing theinsulation material of the STI element isolation structures 4, forexample, an HF solution or the like is used to wet-etch the surfacelayer of the insulation material of the STI element isolation structures4 for removal. This wet-etching exposes the surface layers 2 a and 3 aof the active regions 2 and 3 in a thickness of, for example, about 30nm respectively. As will be described later, in the surface layers 2 aand 3 a, channel regions will be formed.

Subsequently, as shown in FIG. 4C, gate electrodes 6 are pattern-formedwhich extend from above the surface layers 2 a and 3 a of the activeregions 2 and 3 via gate insulation films 5 to the STI element isolationstructures 4.

More specifically, first, the gate insulation film 5 having a filmthickness of about 1 nm made of, for example, a silicon oxide film isformed on the active regions 2 and 3 by, for example, the thermaloxidation method.

Next, a polycrystalline silicon film (not shown) is deposited to have afilm thickness of about 100 nm on the entire surface including the gateinsulation film 5 by, for example, the CVD method. Then, thepolycrystalline silicon film and the gate insulation film 5 arepatterned by the lithography and the dry etching, therebypattern-forming the gate electrodes 6 each covering the top face andboth side faces of each of the surface layers 2 a and 3 a of the activeregions 2 and 3 and extending over the STI element isolation structures4, respectively.

It is also preferable to form the gate electrodes 6 on a condition thatwhen the gate electrodes 6 are formed, the gate electrodes 6 relieve thecompression stress applied to the portions which will become the activeregions 2 and 3 or apply expansion stress to the portions. For example,when the polycrystalline silicon film becoming the gate electrodes 6 isformed, it is formed at a temperature of, for example, 700° C. to 1000°C., for example, 850° C. The formation of the gate electrodes 6 in theabove manner relieves the compression stress applied to the portionsbecoming the channel regions (or applies expansion stress to theportions), thereby further contributing to the improvement in theon-current.

Subsequently, as shown in FIG. 4D, extension regions 7 and extensionregions 8 are formed within the active regions 2 of the P-MOS transistorand the active region 3 of the N-type MOS transistor, respectively.

More specifically, first, a resist mask (not shown) is formed whichcovers only the active region 3 side, and ion implantation of P-typeimpurities, boron (B) here is performed to the active region 2 on acondition of an acceleration energy of 1 keV and a dose amount of1×10¹⁵/cm². During the implantation, the P-type extension regions 7 areformed on both sides of the gate electrode 6 with the gate electrode 6serving as a mask within the active region 2.

Next, after the resist mask is removed by ashing or the like, a resistmask (not shown) is formed which covers only the active region 2 side.Then, using this resist mask, ion implantation of N-type impurities,phosphor (P) here is performed to the active region 3 on a condition ofan acceleration energy of 1 keV and a dose amount of 2×10¹⁵/cm². Duringthe implantation, the N-type extension regions 8 are formed on bothsides of the gate electrode 6 with the gate electrode 6 serving as amask within the active region 3. The resist mask is then removed byashing or the like.

Subsequently, as shown in FIG. 4E, side wall spacers 9 are formed onboth side faces of each of the gate electrodes 6.

More specifically, an insulation film, a silicon oxide film (not shown)here is deposited on the entire surface to cover the gate electrodes 6.Anisotropic etching (etch back) is then performed for the entire surfaceof the silicon oxide film to leave the silicon oxide film only on bothside faces of the gate electrodes 6, thereby forming the side wallspacers 9, respectively.

Subsequently, as shown in FIG. 3C and FIG. 4F, source/drain regions 11and source/drain regions 12 are formed within the active region 2 of theP-type MOS transistor and the active region 3 of the N-type MOStransistor, respectively.

More specifically, first, a resist mask (not shown) is formed whichcovers the active region 3 side, and ion implantation of P-typeimpurities, boron (B) here is performed to the active region 2 on acondition of an acceleration energy of 40 keV and a dose amount of5×10¹⁵/cm². During the implantation, the P-type source/drain regions 11which are deeper than the extension regions 7 are formed, in a manner topartially overlap with the P-type extension regions 7, on both sides ofthe side wall spacers 9 with the gate electrode 6 and the side wallspaces 9 serving as a mask within the active region 2.

Next, after the resist mask is removed by ashing or the like, a resistmask (not shown) is formed which covers the active region 2 side. Usingthis resist mask, ion implantation of N-type impurities, phosphor (P)here is performed to the active region 3 on a condition of anacceleration energy of 40 keV and a dose amount of 5×10¹⁵/cm². Duringthe implantation, the N-type source/drain regions 12 which are deeperthan the extension regions 8 are formed, in a manner to partiallyoverlap with the N-type extension regions 8, on both sides of the sidewall spacers 9 with the gate electrode 6 and the side wall spaces 9serving as a mask within the active region 3.

Then, after the resist mask is removed by ashing or the like, annealingprocessing is performed for the silicon substrate 1 at 1050° C. forabout 10 seconds. This annealing processing activates the variousimpurities ion-implanted for the formation of the extension regions 7and 8 and the source/drain regions 11 and 12.

Thereafter, through formation of an interlayer insulation film, variousconnection holes, wirings and so on, a CMOS transistor including theP-type MOS transistor within the active region 2 and the N-type MOStransistor within the active region 3 is completed.

In this embodiment, as shown in FIG. 3C, the rectangular region betweenthe extension regions 7 becomes a channel region 2 b within the activeregion 2, and the rectangular region between the extension regions 8becomes a channel region 3 b within the active region 3. Each of thechannel regions 2 b and 3 b is covered by the gate electrode 6 via thegate insulation film 5 and the side wall spacers 9 starting from its topface to the both side faces along the x-direction. In other words, thereis no insulation material of the STI element isolation structure 4 onboth side faces along the x-direction of each of the channel regions 2 band 3 b (in a non-contact state), thereby accordingly preventing stressin the z-direction from the STI element isolation structure 4 from beingapplied to each of the channel regions 2 b and 3 b. In this case, theyare hardly affected by restraint by the gate-width direction dependence.This configuration can prevent a decrease in the on-current both in theP-type and the N-type MOS transistors, with little or no gate-widthdirection dependence and irrespective of the conduction type thereof.

As described above, according to this embodiment, it is possible tosignificantly reduce the gate-width direction dependence of the stressand relieve the stress applied to the active regions easily and surely,without causing an increase in processes and complication of processesin a CMOS transistor including the STI element isolation structures 4,so as to realize a reliable CMOS transistor having excellent currentcharacteristics.

-Modification Example-

Here, a modification example of the first embodiment will be described.In this modification example, a CMOS transistor is manufactured as inthe first embodiment, but is different in that a process is added whichrelieves the stress of the STI element isolation structure 4 byintroduction of an element.

FIGS. 5A and 5B are schematic views showing processes added to the firstembodiment in this modification example, and FIG. 5A is a schematic planview and FIG. 5B is a schematic cross-sectional view along a broken lineI-I in FIG. 5A.

First, processes in FIGS. 4A and 4B (FIGS. 3A and 3B) are performed.

Subsequently, as shown in FIGS. 5A and 5B, a resist mask 13 covering theactive region 2 and extending in the x-direction is formed only withinthe active region 2 for the P-type MOS transistor.

More specifically, a resist is applied over the entire surface andprocessed by lithography to thereby form the resist mask 13 only on theactive region 2 side which covers the active region 2 and extends overthe STI element isolation structure 4, with an almost the same width asthat of the active region 2 in the z-direction. Both side faces alongthe z-direction of the active region 2 are covered by the resist mask 13here, whereas both side faces along the x-direction of the active region2 are not covered by the resist mask 13 but exposed.

Then, in the state shown in FIGS. 5A and 5B, ion-implantation into thesurface layer of the STI element isolation structure 4 is performedusing a relatively heavy element such as Ge, Si or the like, Ge here. Onthe active region 2 side, portions exposed by the resist mask 13 of theSTI element isolation structure 4, that is, portions in contact withboth end faces 2 c along the x-direction of the active region 2 (regionsR surrounded by the broken line in the drawing) are made amorphous bythe ion implantation of Ge. On the other hand, on the active region 3side, the entire surface of the STI element isolation structure 4 ismade amorphous by the ion implantation of Ge.

It should be noted that although the active region 3 is also madeamorphous by the above-described ion implantation of Ge, it isre-crystallized by the later-described annealing processing, thuscausing no problem. As a matter of course, it is also possible to form aresist mask covering only the active region 3 together with the resistmask 13, thereby preventing Ge from entering the active region 3.

Subsequently, processes of FIGS. 4C to 4F (FIG. 3C) are performed.

Then, after the resist mask is removed by ashing or the like, annealingprocessing is performed for the silicon substrate 1 at 1050° C. forabout 10 seconds. This annealing processing activates the variousimpurities ion-implanted for the formation of the extension regions 7and 8 and the source/drain regions 11 and 12. At this time, theannealing processing simultaneously re-crystallizes the portion of theSTI element isolation structure 4 into which Ge has been introduced (andthe active region 3). This re-crystallization relieves the compressionstress applied by the STI element isolation structures 4 to the activeregions 2 and 3. In other words, on the active region 2 side, thecompression stress in the z-direction is relieved which is applied bythe regions R to both end faces 2 c of the active region 2. On the otherhand, on the active region 3 side, the compression stress is relievedwhich is applied by the STI element isolation structure 4 to four endfaces of the active regions 3, that is, both end faces along thex-direction and both end faces along the z-direction.

To increase the on-current, it is only required here to applycompression stress in the x-direction and expansion stress in thez-direction for the P-type MOS transistor as shown in FIG. 1.Conversely, for the N-type MOS transistor, it is only required to applyexpansion stress both in the x-direction and the z-direction. In thismodification example, the above-described re-crystallization appliescompression stress in the x-direction and expansion stress in thez-direction within the active region 2 of the P-type MOS transistor, andapplies expansion stress both in the x-direction and the z-directionwithin the active region 3 of the N-type MOS transistor. This increasesthe on-current on the best condition for each of the P-type and N-typeMOS transistors, respectively.

Thereafter, through formation of an interlayer insulation film, variousconnection holes, wirings and so on, a CMOS transistor including theP-type MOS transistor within the active region 2 and the N-type MOStransistor within the active region 3 is completed.

As described above, according to this modification example, it ispossible to significantly reduce the gate-width direction dependence ofthe stress and relieve the stress applied to the active regions easilyand surely on the respective optimum conditions for the P-type andN-type MOS transistors, in a CMOS transistor including the STI elementisolation structures 4, in order to realize a reliable CMOS transistorhaving excellent current characteristics.

-Second Embodiment-

FIGS. 6A to 6C are schematic views showing main processes in a method ofmanufacturing a CMOS transistor according to the second embodimentselected only for the P-type MOS transistor. The left drawing is aschematic perspective view and the right drawing is a schematic planview in each of FIGS. 6A and 6B, and FIG. 6C illustrates a schematicplan view of a completion view of the P-type MOS transistor showing thestate in which its gate insulation film, gate electrode, and side wallspacers are removed therefrom. In the drawings of FIGS. 6A to 6C, thenumerals and symbols of components and so on associated with the N-typeMOS transistor are shown in parentheses. FIGS. 7A to 7E are schematiccross-sectional views showing the method of manufacturing the CMOStransistor according to the second embodiment in the order of processes,each view corresponding to a schematic cross section along an x-y planeshown in FIGS. 6A to 6C. Note that the same numerals and symbols areshown for the components and so on corresponding to those in the firstembodiment for convenience of explanation.

First, as shown in FIG. 6A and FIG. 7A, on a silicon substrate 1, anactive region 21 of the P-type MOS transistor and an active region 22 ofthe N-type MOS transistor are defined, respectively.

More specifically, element isolation structures are formed respectivelywithin the element isolation region for the P-type MOS transistor andthe element isolation region for the N-type MOS transistor on asemiconductor substrate, that is, the silicon substrate 1, so as todefine the active regions 21 and 22. As the element isolationstructures, the STI method is used to fill grooves 23 a which are formedwithin the element isolation regions by lithography and dry etching,with an insulation material such as a silicon oxide or the like, andthen, for example, the CMP (Chemical Mechanical Polishing) method isused to polish for flattening the surface of the insulation material toform STI element isolation structures 23.

In this embodiment, the groove 23 a is formed in a shape in which eachof the active regions 21 and 22 has protruding portions 21 a or 22 aprotruding from a pair of side faces of a rectangle, in other words inan almost cross shape, and an insulation material is embedded in thegroove 23 a and flattened to form the STI element isolation structure23.

Subsequently, as shown in FIG. 7B, gate electrodes 6 are pattern-formedin a shape extending along tops of the protruding portions 21 a and 22 aabove the active regions 21 and 22 via gate insulation films 5.

More specifically, first, the gate insulation film 5 having a filmthickness of about 1 nm made of, for example, a silicon oxide film isformed on the active regions 21 and 22 by, for example, the thermaloxidation method.

Next, a polycrystalline silicon film (not shown) is deposited to have afilm thickness of about 100 nm on the entire surface including the gateinsulation film 5 by, for example, the CVD method. Then, thepolycrystalline silicon film and the gate insulation film 5 arepatterned by the lithography and the dry etching, therebypattern-forming the gate electrodes 6 extending along tops of therespective protruding portions 21 a and 22 a above the active regions 21and 22 via the gate insulation films 5, respectively.

Note that it is also preferable to form the gate electrodes 6 on acondition that when the gate electrodes 6 are formed, the gateelectrodes 6 relieve the compression stress applied to the portionswhich will become the active regions 21 and 22 or apply expansion stressto the portions. For example, when the polycrystalline silicon filmbecoming the gate electrodes 6 is formed, it is formed at a temperatureof, for example, 700° C. to 1000° C., for example, 850° C. The formationof the gate electrodes 6 in the above manner relieves the compressionstress applied to the portions becoming the channel regions (or appliesexpansion stress to the portions), thereby further contributing to theimprovement in the on-current.

Subsequently, as shown in FIG. 7C, extension regions 7 and extensionregions 8 are formed within the active regions 21 of the P-MOStransistor and the active region 22 of the N-type MOS transistor,respectively.

More specifically, first, a resist mask (not shown) is formed whichcovers only the active region 22 side, and ion implantation of P-typeimpurities, boron (B) here is performed to the active region 21 on acondition of an acceleration energy of 1 keV and a dose amount of1×10¹⁵/cm². During the implantation, the P-type extension regions 7 areformed on both sides of the gate electrode 6 with the gate electrode 6serving as a mask within the active region 21.

Next, after the resist mask is removed by ashing or the like, a resistmask (not shown) is formed which covers only the active region 21 side.Then, using this resist mask, ion implantation of N-type impurities,phosphor (P) here is performed to the active region 22 on a condition ofan acceleration energy of 1 keV and a dose amount of 2×10¹⁵/cm². Duringthe implantation, the N-type extension regions 8 are formed on bothsides of the gate electrode 6 with the gate electrode 6 serving as amask within the active region 22. The resist mask is then removed byashing or the like.

Subsequently, as shown in FIG. 7D, side wall spacers 9 are formed onboth side faces of each of the gate electrodes 6.

More specifically, an insulation film, a silicon oxide film (not shown)here is deposited on the entire surface to cover the gate electrodes 6.Anisotropic etching (etch back) is then performed for the entire surfaceof the silicon oxide film to leave the silicon oxide film only on bothside faces of the gate electrodes 6, thereby forming the side wallspacers 9, respectively.

The surface layer of the STI element isolation structures 23 is etchedhere except for portions under the gate electrodes 6 and the side wallspacers 9, mainly due to the entire surface anisotropic etching at thetime of formation of the side wall spacers 9.

Subsequently, as shown in FIG. 7E and FIG. 6B, source/drain regions 11and source/drain regions 12 are formed within the active region 21 ofthe P-type MOS transistor and the active region 22 of the N-type MOStransistor, respectively.

More specifically, first, a resist mask (not shown) is formed whichcovers the active region 22 side, and ion implantation of P-typeimpurities, boron (B) here is performed to the active region 21 on acondition of an acceleration energy of 40 keV and a dose amount of5×10¹⁵/cm². During the implantation, the P-type source/drain regions 11which are deeper than the extension regions 7 are formed, in a manner topartially overlap with the P-type extension regions 7 on both sides ofthe side wall spacers 9, with the gate electrode 6 and the side wallspaces 9 serving as a mask within the active region 21.

Next, after the resist mask is removed by ashing or the like, a resistmask (not shown) is formed which covers the active region 21 side. Usingthis resist mask, ion implantation of N-type impurities, phosphor (P)here is performed to the active region 22 on a condition of anacceleration energy of 40 keV and a dose amount of 5×10¹⁵/cm². Duringthe implantation, the N-type source/drain regions 12 which are deeperthan the extension regions 8 are formed, in a manner to partiallyoverlap with the N-type extension regions 8 on both sides of the sidewall spacers 9, with the gate electrode 6 and the side wall spaces 9serving as a mask within the active region 22.

Then, after the resist mask is removed by ashing or the like, annealingprocessing is performed for the silicon substrate 1 at 1050° C. forabout 10 seconds. This annealing processing activates the variousimpurities ion-implanted for the formation of the extension regions 7and 8 and the source/drain regions 11 and 12.

Thereafter, through formation of an interlayer insulation film, variousconnection holes, wirings and so on, a CMOS transistor including theP-type MOS transistor within the active region 21 and the N-type MOStransistor within the active region 22 is completed, respectively.

In this embodiment, as shown in FIG. 6B and 6C, the rectangular regionbetween the source/drain regions 11 except the protruding portions 21 abecomes a channel region 21 b within the active region 21, and therectangular region between the source/drains 12 except the protrudingportions 22 a becomes a channel region 22 b within the active region 22.Each of the channel regions 21 b and 22 b is separated from a remainingportion 23 a of the insulation material of the STI element isolationstructure 23 by the protruding portion 21 a or 22 a by the amountthereof and is thus brought into a so-called non-contact state with theremaining portion 23 a. Accordingly, the compression stress in thez-direction applied to of each of the channel region 21 a and 22 b bythe STI element isolation structure 23 is reduced. Further, an increasein the width (in gate-width direction) of the active region 21 and 22 bythe amount of the protruding portions 21 a and 22 a relieves thegate-width direction dependence, resulting in increased on-current asshown in the characteristic diagram in FIG. 8. This configuration canprevent a decrease in the on-current both in the P-type and the N-typeMOS transistors with very little gate-width direction dependence as wellas irrespective of the conduction type thereof.

As described above, according to this embodiment, it is possible tosignificantly reduce the gate-width direction dependence of the stressand relieve the stress applied to the active regions easily and surely,without causing an increase in processes and complication of processesin a CMOS transistor having the STI element isolation structures 23, soas to realize a reliable CMOS transistor having excellent currentcharacteristics.

Note that, in the second embodiment, it is also preferable to add aprocess as in the modification example of the first embodiment torelieve the stress of the STI element isolation structure 4 byintroduction of Ge or the like.

According to the present invention, it is possible to significantlyreduce the gate-width direction dependence of the stress and relieve thestress applied to the active regions easily and surely, without causingan increase in processes and complication of processes in asemiconductor device including the STI element isolation structure, soas to realize a reliable semiconductor device having excellent currentcharacteristics.

1. A semiconductor device, comprising: an element isolation structureformed by embedding an insulation material in a groove formed within anelement isolation region of a semiconductor substrate; an active regiondefined in the semiconductor substrate by said element isolationstructure; a gate electrode pattern-formed above said active region viaa gate insulation film; and a transistor structure having a pair ofimpurity diffused layers formed within said active region on both sidesof said gate electrode, wherein said element isolation structure is in anon-contact state with at least both side faces along a gate-lengthdirection of a channel region constituting a substantial current passingregion formed between said impurity diffused layers within said activeregion.
 2. The semiconductor device according to claim 1, wherein saidgate electrode is formed to cover said channel region from a top face toboth side faces thereof via said gate insulation film.
 3. Thesemiconductor device according to claim 1, wherein: said active regionhas a pair of protruding portions protruding back and forth in agate-width direction from said channel region; and said protrudingportions separate said channel region from said element isolationstructure in the gate-width direction.
 4. The semiconductor deviceaccording to claim 1, wherein said gate electrode is formed to apply anexpansion strain to said channel region.
 5. The semiconductor deviceaccording to claim 1, wherein: at least portions of said elementisolation structure in contact with end faces parallel to the gatelength of said active region are re-crystallized, so that a compressionstress in the gate-width direction to said active region by said elementisolation structure is relieved.
 6. The semiconductor device accordingto claim 1, wherein, said transistor structure of an N-type in whichsaid impurity diffused layers are formed by introduction of N-typeimpurities and said transistor structure of a P-type in which saidimpurity diffused layers are formed by introduction of P-typeimpurities, are formed on the same semiconductor substrate.
 7. A methodof manufacturing a semiconductor device, comprising the steps of:forming a groove within an element isolation region of a semiconductorsubstrate; embedding an insulation material in the groove to form anelement isolation structure to thereby define an active region on thesemiconductor substrate; partially removing the insulation material ofthe element isolation structure to expose a surface layer portion of theactive region; pattern-forming a gate electrode in such a manner as tocover the surface layer portion from a top face to both side facesthereof via a gate insulation film; and introducing impurities into theactive region on both sides of the gate electrode to form a pair ofimpurity diffused layers.
 8. A method of manufacturing a semiconductordevice, comprising the steps of: forming a groove within an elementisolation region of a semiconductor substrate; embedding an insulationmaterial in the groove to form an element isolation structure to therebydefine an active region on the semiconductor substrate in a shape havingprotruding portions protruding from a pair of side faces of a rectanglerespectively; pattern-forming a gate electrode in a shape extendingalong tops of the protruding portions via a gate insulation film abovethe active region; and introducing impurities into the active region onboth sides of the gate electrode to form a pair of impurity diffusedlayers.
 9. The method of manufacturing a semiconductor device accordingto claim 7, wherein the gate electrode is formed on a condition that thegate electrode applies an expansion strain to the channel region. 10.The method of manufacturing a semiconductor device according to claim 7,further comprising the steps of: prior to the formation of the gateinsulation film, making a surface layer of the element isolationstructure amorphous; and after the formation of the pair of impuritydiffused layers, performing annealing processing to activate theimpurities and re-crystallize the surface layer of the element isolationstructure which has been made amorphous.
 11. The method of manufacturinga semiconductor device according to claim 10, wherein in a case ofmanufacturing a P-type MOS transistor, prior to the formation of thegate insulation film, a mask is formed which exposes portions of theelement isolation structure in contact with end faces parallel to thegate length of the active region, and the exposed portions of thesurface layer of the element isolation structure are made amorphoususing the mask.
 12. The method of manufacturing a semiconductor deviceaccording to claim 10, wherein in a case of manufacturing an N-type MOStransistor, the entire surface layer of the element isolation structureis made amorphous.
 13. The method of manufacturing a semiconductordevice according to claim 7, wherein the transistor structure of anN-type in which the impurity diffused layers are formed by introductionof N-type impurities and the transistor structure of a P-type in whichthe impurity diffused layers are formed by introduction of P-typeimpurities, are formed on the same semiconductor substrate.